Effect of dentinal surface preparation on bond strength of self-etching adhesives

Cynthia K.Y. Yiu, Noriko Hiraishi, Nigel M. King, Franklin Chi Meng Tay

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

Purpose: This study examined the effects of cutting dentin with different burs at various speeds on the microtensile bond strength (μTBS) of two self-etching adhesive systems. Materials and Methods: Flat deep dentin surfaces from 50 extracted human third molars were divided into 5 groups (n = 10) according to bur type and speed of rotation: (I) high-speed diamond bur, (II) low-speed diamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with 600-grit SiC paper. A two-step self-etching adhesive, Clearfil SE Bond (SE, Kuraray) and a one-step self-etching adhesive, Clearfil S3 Bond (S3, Kuraray) were applied to dentin surfaces and light cured. Composite buildups were performed using Filtek Z250 (3M ESPE). For μTBS evaluation, composite-dentin beams of 0.8 mm2 were stressed to failure at a crosshead speed of 1 mm/min. The μTBS data were analyzed using two-way ANOVA and Tukey's multiple comparison tests. Representative fractured beams from each group were prepared for fractographic analysis under SEM. Results: Two-way ANOVA showed that the effects of dentin surface preparations, adhesive systems, and their interaction were statistically significant (p < 0.001). The μTBS was the highest when bonding SE to dentin surface prepared with 600-grit SiC abrasive paper (47.3 ± 7.4 MPa), followed by high-speed tungsten carbide burs (40.8 ± 6.1 MPa), and the lowest when bonding S3 to dentin surfaces prepared with a high-speed diamond bur (15.2 ± 6.2 MPa). SEM observation of the fractured surfaces revealed mixed and adhesive failures for SE groups, while in the S3 groups, adhesive failures predominated with numerous inclusion droplets. Conclusion: Higher bond strengths are achieved with SE bond when applied on dentin surfaces prepared with tungsten carbide burs. Proper bur and adhesive selection are essential to optimize dentin adhesion of self-etching adhesives.

Original languageEnglish (US)
Pages (from-to)173-182
Number of pages10
JournalJournal of Adhesive Dentistry
Volume10
Issue number3
StatePublished - Jul 4 2008

Fingerprint

Dentin
Adhesives
Diamond
Analysis of Variance
Third Molar
Observation
Light
tungsten carbide

Keywords

  • Dentin
  • Microtensile bond strength
  • Self-etching adhesive
  • Surface preparation

ASJC Scopus subject areas

  • Medicine(all)

Cite this

Effect of dentinal surface preparation on bond strength of self-etching adhesives. / Yiu, Cynthia K.Y.; Hiraishi, Noriko; King, Nigel M.; Tay, Franklin Chi Meng.

In: Journal of Adhesive Dentistry, Vol. 10, No. 3, 04.07.2008, p. 173-182.

Research output: Contribution to journalArticle

Yiu, Cynthia K.Y. ; Hiraishi, Noriko ; King, Nigel M. ; Tay, Franklin Chi Meng. / Effect of dentinal surface preparation on bond strength of self-etching adhesives. In: Journal of Adhesive Dentistry. 2008 ; Vol. 10, No. 3. pp. 173-182.
@article{b8cffe484c154cd1b055f53977852ff3,
title = "Effect of dentinal surface preparation on bond strength of self-etching adhesives",
abstract = "Purpose: This study examined the effects of cutting dentin with different burs at various speeds on the microtensile bond strength (μTBS) of two self-etching adhesive systems. Materials and Methods: Flat deep dentin surfaces from 50 extracted human third molars were divided into 5 groups (n = 10) according to bur type and speed of rotation: (I) high-speed diamond bur, (II) low-speed diamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with 600-grit SiC paper. A two-step self-etching adhesive, Clearfil SE Bond (SE, Kuraray) and a one-step self-etching adhesive, Clearfil S3 Bond (S3, Kuraray) were applied to dentin surfaces and light cured. Composite buildups were performed using Filtek Z250 (3M ESPE). For μTBS evaluation, composite-dentin beams of 0.8 mm2 were stressed to failure at a crosshead speed of 1 mm/min. The μTBS data were analyzed using two-way ANOVA and Tukey's multiple comparison tests. Representative fractured beams from each group were prepared for fractographic analysis under SEM. Results: Two-way ANOVA showed that the effects of dentin surface preparations, adhesive systems, and their interaction were statistically significant (p < 0.001). The μTBS was the highest when bonding SE to dentin surface prepared with 600-grit SiC abrasive paper (47.3 ± 7.4 MPa), followed by high-speed tungsten carbide burs (40.8 ± 6.1 MPa), and the lowest when bonding S3 to dentin surfaces prepared with a high-speed diamond bur (15.2 ± 6.2 MPa). SEM observation of the fractured surfaces revealed mixed and adhesive failures for SE groups, while in the S3 groups, adhesive failures predominated with numerous inclusion droplets. Conclusion: Higher bond strengths are achieved with SE bond when applied on dentin surfaces prepared with tungsten carbide burs. Proper bur and adhesive selection are essential to optimize dentin adhesion of self-etching adhesives.",
keywords = "Dentin, Microtensile bond strength, Self-etching adhesive, Surface preparation",
author = "Yiu, {Cynthia K.Y.} and Noriko Hiraishi and King, {Nigel M.} and Tay, {Franklin Chi Meng}",
year = "2008",
month = "7",
day = "4",
language = "English (US)",
volume = "10",
pages = "173--182",
journal = "The journal of adhesive dentistry",
issn = "1461-5185",
publisher = "Quintessence Publishing Company",
number = "3",

}

TY - JOUR

T1 - Effect of dentinal surface preparation on bond strength of self-etching adhesives

AU - Yiu, Cynthia K.Y.

AU - Hiraishi, Noriko

AU - King, Nigel M.

AU - Tay, Franklin Chi Meng

PY - 2008/7/4

Y1 - 2008/7/4

N2 - Purpose: This study examined the effects of cutting dentin with different burs at various speeds on the microtensile bond strength (μTBS) of two self-etching adhesive systems. Materials and Methods: Flat deep dentin surfaces from 50 extracted human third molars were divided into 5 groups (n = 10) according to bur type and speed of rotation: (I) high-speed diamond bur, (II) low-speed diamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with 600-grit SiC paper. A two-step self-etching adhesive, Clearfil SE Bond (SE, Kuraray) and a one-step self-etching adhesive, Clearfil S3 Bond (S3, Kuraray) were applied to dentin surfaces and light cured. Composite buildups were performed using Filtek Z250 (3M ESPE). For μTBS evaluation, composite-dentin beams of 0.8 mm2 were stressed to failure at a crosshead speed of 1 mm/min. The μTBS data were analyzed using two-way ANOVA and Tukey's multiple comparison tests. Representative fractured beams from each group were prepared for fractographic analysis under SEM. Results: Two-way ANOVA showed that the effects of dentin surface preparations, adhesive systems, and their interaction were statistically significant (p < 0.001). The μTBS was the highest when bonding SE to dentin surface prepared with 600-grit SiC abrasive paper (47.3 ± 7.4 MPa), followed by high-speed tungsten carbide burs (40.8 ± 6.1 MPa), and the lowest when bonding S3 to dentin surfaces prepared with a high-speed diamond bur (15.2 ± 6.2 MPa). SEM observation of the fractured surfaces revealed mixed and adhesive failures for SE groups, while in the S3 groups, adhesive failures predominated with numerous inclusion droplets. Conclusion: Higher bond strengths are achieved with SE bond when applied on dentin surfaces prepared with tungsten carbide burs. Proper bur and adhesive selection are essential to optimize dentin adhesion of self-etching adhesives.

AB - Purpose: This study examined the effects of cutting dentin with different burs at various speeds on the microtensile bond strength (μTBS) of two self-etching adhesive systems. Materials and Methods: Flat deep dentin surfaces from 50 extracted human third molars were divided into 5 groups (n = 10) according to bur type and speed of rotation: (I) high-speed diamond bur, (II) low-speed diamond bur, (III) high-speed tungsten carbide bur, (IV) low-speed tungsten carbide bur. Controls were abraded with 600-grit SiC paper. A two-step self-etching adhesive, Clearfil SE Bond (SE, Kuraray) and a one-step self-etching adhesive, Clearfil S3 Bond (S3, Kuraray) were applied to dentin surfaces and light cured. Composite buildups were performed using Filtek Z250 (3M ESPE). For μTBS evaluation, composite-dentin beams of 0.8 mm2 were stressed to failure at a crosshead speed of 1 mm/min. The μTBS data were analyzed using two-way ANOVA and Tukey's multiple comparison tests. Representative fractured beams from each group were prepared for fractographic analysis under SEM. Results: Two-way ANOVA showed that the effects of dentin surface preparations, adhesive systems, and their interaction were statistically significant (p < 0.001). The μTBS was the highest when bonding SE to dentin surface prepared with 600-grit SiC abrasive paper (47.3 ± 7.4 MPa), followed by high-speed tungsten carbide burs (40.8 ± 6.1 MPa), and the lowest when bonding S3 to dentin surfaces prepared with a high-speed diamond bur (15.2 ± 6.2 MPa). SEM observation of the fractured surfaces revealed mixed and adhesive failures for SE groups, while in the S3 groups, adhesive failures predominated with numerous inclusion droplets. Conclusion: Higher bond strengths are achieved with SE bond when applied on dentin surfaces prepared with tungsten carbide burs. Proper bur and adhesive selection are essential to optimize dentin adhesion of self-etching adhesives.

KW - Dentin

KW - Microtensile bond strength

KW - Self-etching adhesive

KW - Surface preparation

UR - http://www.scopus.com/inward/record.url?scp=46049111485&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=46049111485&partnerID=8YFLogxK

M3 - Article

C2 - 18652265

AN - SCOPUS:46049111485

VL - 10

SP - 173

EP - 182

JO - The journal of adhesive dentistry

JF - The journal of adhesive dentistry

SN - 1461-5185

IS - 3

ER -