Low-temperature electrospun silk scaffold for in vitro mucosal modeling

Anna A. Bulysheva, Gary L. Bowlin, Aloysius J. Klingelhutz, William Andrew Yeudall

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

Electrospinning is often used to create scaffolding as a biomimetic of the extracellular matrix of tissues. A frequent limitation of this technique for three-dimensional tissue modeling is poor cell infiltration throughout the void volume of scaffolds. Here, we generated low-temperature electrospun silk scaffolds and compared these with conventional electrospun silk scaffolds in terms of mechanical properties, void volume, cell infiltration, cell viability, and potential to support mucosal models under three-dimensional culture conditions. Low-temperature electrospun silk scaffolds supported fibroblast attachment and infiltration throughout the volume of the scaffolds, while conventional electrospun scaffolds exhibited limited cell infiltration with fibroblasts attaching exclusively to the seeding surface of the scaffolds. The porosity of low-temperature electrospun scaffolds was 93% compared with 88% of conventional electrospun silk scaffolds. Uniaxial tensile testing showed a 3.5-fold reduction in strength of low-temperature electrospun silk compared with the conventional in terms of peak stress and modulus but no significant change in strain at break. Mucosal modeling with fibroblast-keratinocyte or fibroblast-carcinoma cocultures showed similar results, with cell infiltration occurring only in low-temperature electrospun scaffolds. Cell viability was confirmed using live/dead staining after 21 days in culture. Furthermore, low-temperature electrospun silk scaffolds were able to support keratinocyte differentiation, as judged by involucrin immunoreactivity. The low-temperature electrospun silk scaffold that we have developed eliminates the limitation of electrospun silk scaffolds in terms of cell infiltration and, therefore, can potentially be used for a wide range of tissue engineering purposes ranging from in vitro tissue modeling to in vivo tissue regeneration purposes.

Original languageEnglish (US)
Pages (from-to)757-767
Number of pages11
JournalJournal of Biomedical Materials Research - Part A
Volume100 A
Issue number3
DOIs
StatePublished - Mar 1 2012

Fingerprint

Silk
Scaffolds
Temperature
Infiltration
Fibroblasts
Keratinocytes
Cell Survival
Tissue
Biomimetics
In Vitro Techniques
Porosity
Tissue Engineering
Coculture Techniques
Cell Size
Cells
Extracellular Matrix
Regeneration
Tissue regeneration
Tensile testing
Electrospinning

Keywords

  • cell infiltration
  • cryogenic electrospinning
  • fibroblasts
  • keratinocytes
  • low-temperature electrospinning
  • silk

ASJC Scopus subject areas

  • Ceramics and Composites
  • Biomaterials
  • Biomedical Engineering
  • Metals and Alloys

Cite this

Low-temperature electrospun silk scaffold for in vitro mucosal modeling. / Bulysheva, Anna A.; Bowlin, Gary L.; Klingelhutz, Aloysius J.; Yeudall, William Andrew.

In: Journal of Biomedical Materials Research - Part A, Vol. 100 A, No. 3, 01.03.2012, p. 757-767.

Research output: Contribution to journalArticle

Bulysheva, Anna A. ; Bowlin, Gary L. ; Klingelhutz, Aloysius J. ; Yeudall, William Andrew. / Low-temperature electrospun silk scaffold for in vitro mucosal modeling. In: Journal of Biomedical Materials Research - Part A. 2012 ; Vol. 100 A, No. 3. pp. 757-767.
@article{4b6b6b4a7651420d96587bd4ffda9562,
title = "Low-temperature electrospun silk scaffold for in vitro mucosal modeling",
abstract = "Electrospinning is often used to create scaffolding as a biomimetic of the extracellular matrix of tissues. A frequent limitation of this technique for three-dimensional tissue modeling is poor cell infiltration throughout the void volume of scaffolds. Here, we generated low-temperature electrospun silk scaffolds and compared these with conventional electrospun silk scaffolds in terms of mechanical properties, void volume, cell infiltration, cell viability, and potential to support mucosal models under three-dimensional culture conditions. Low-temperature electrospun silk scaffolds supported fibroblast attachment and infiltration throughout the volume of the scaffolds, while conventional electrospun scaffolds exhibited limited cell infiltration with fibroblasts attaching exclusively to the seeding surface of the scaffolds. The porosity of low-temperature electrospun scaffolds was 93{\%} compared with 88{\%} of conventional electrospun silk scaffolds. Uniaxial tensile testing showed a 3.5-fold reduction in strength of low-temperature electrospun silk compared with the conventional in terms of peak stress and modulus but no significant change in strain at break. Mucosal modeling with fibroblast-keratinocyte or fibroblast-carcinoma cocultures showed similar results, with cell infiltration occurring only in low-temperature electrospun scaffolds. Cell viability was confirmed using live/dead staining after 21 days in culture. Furthermore, low-temperature electrospun silk scaffolds were able to support keratinocyte differentiation, as judged by involucrin immunoreactivity. The low-temperature electrospun silk scaffold that we have developed eliminates the limitation of electrospun silk scaffolds in terms of cell infiltration and, therefore, can potentially be used for a wide range of tissue engineering purposes ranging from in vitro tissue modeling to in vivo tissue regeneration purposes.",
keywords = "cell infiltration, cryogenic electrospinning, fibroblasts, keratinocytes, low-temperature electrospinning, silk",
author = "Bulysheva, {Anna A.} and Bowlin, {Gary L.} and Klingelhutz, {Aloysius J.} and Yeudall, {William Andrew}",
year = "2012",
month = "3",
day = "1",
doi = "10.1002/jbm.a.33288",
language = "English (US)",
volume = "100 A",
pages = "757--767",
journal = "Journal of Biomedical Materials Research - Part A",
issn = "0021-9304",
publisher = "Heterocorporation",
number = "3",

}

TY - JOUR

T1 - Low-temperature electrospun silk scaffold for in vitro mucosal modeling

AU - Bulysheva, Anna A.

AU - Bowlin, Gary L.

AU - Klingelhutz, Aloysius J.

AU - Yeudall, William Andrew

PY - 2012/3/1

Y1 - 2012/3/1

N2 - Electrospinning is often used to create scaffolding as a biomimetic of the extracellular matrix of tissues. A frequent limitation of this technique for three-dimensional tissue modeling is poor cell infiltration throughout the void volume of scaffolds. Here, we generated low-temperature electrospun silk scaffolds and compared these with conventional electrospun silk scaffolds in terms of mechanical properties, void volume, cell infiltration, cell viability, and potential to support mucosal models under three-dimensional culture conditions. Low-temperature electrospun silk scaffolds supported fibroblast attachment and infiltration throughout the volume of the scaffolds, while conventional electrospun scaffolds exhibited limited cell infiltration with fibroblasts attaching exclusively to the seeding surface of the scaffolds. The porosity of low-temperature electrospun scaffolds was 93% compared with 88% of conventional electrospun silk scaffolds. Uniaxial tensile testing showed a 3.5-fold reduction in strength of low-temperature electrospun silk compared with the conventional in terms of peak stress and modulus but no significant change in strain at break. Mucosal modeling with fibroblast-keratinocyte or fibroblast-carcinoma cocultures showed similar results, with cell infiltration occurring only in low-temperature electrospun scaffolds. Cell viability was confirmed using live/dead staining after 21 days in culture. Furthermore, low-temperature electrospun silk scaffolds were able to support keratinocyte differentiation, as judged by involucrin immunoreactivity. The low-temperature electrospun silk scaffold that we have developed eliminates the limitation of electrospun silk scaffolds in terms of cell infiltration and, therefore, can potentially be used for a wide range of tissue engineering purposes ranging from in vitro tissue modeling to in vivo tissue regeneration purposes.

AB - Electrospinning is often used to create scaffolding as a biomimetic of the extracellular matrix of tissues. A frequent limitation of this technique for three-dimensional tissue modeling is poor cell infiltration throughout the void volume of scaffolds. Here, we generated low-temperature electrospun silk scaffolds and compared these with conventional electrospun silk scaffolds in terms of mechanical properties, void volume, cell infiltration, cell viability, and potential to support mucosal models under three-dimensional culture conditions. Low-temperature electrospun silk scaffolds supported fibroblast attachment and infiltration throughout the volume of the scaffolds, while conventional electrospun scaffolds exhibited limited cell infiltration with fibroblasts attaching exclusively to the seeding surface of the scaffolds. The porosity of low-temperature electrospun scaffolds was 93% compared with 88% of conventional electrospun silk scaffolds. Uniaxial tensile testing showed a 3.5-fold reduction in strength of low-temperature electrospun silk compared with the conventional in terms of peak stress and modulus but no significant change in strain at break. Mucosal modeling with fibroblast-keratinocyte or fibroblast-carcinoma cocultures showed similar results, with cell infiltration occurring only in low-temperature electrospun scaffolds. Cell viability was confirmed using live/dead staining after 21 days in culture. Furthermore, low-temperature electrospun silk scaffolds were able to support keratinocyte differentiation, as judged by involucrin immunoreactivity. The low-temperature electrospun silk scaffold that we have developed eliminates the limitation of electrospun silk scaffolds in terms of cell infiltration and, therefore, can potentially be used for a wide range of tissue engineering purposes ranging from in vitro tissue modeling to in vivo tissue regeneration purposes.

KW - cell infiltration

KW - cryogenic electrospinning

KW - fibroblasts

KW - keratinocytes

KW - low-temperature electrospinning

KW - silk

UR - http://www.scopus.com/inward/record.url?scp=84856228797&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84856228797&partnerID=8YFLogxK

U2 - 10.1002/jbm.a.33288

DO - 10.1002/jbm.a.33288

M3 - Article

C2 - 22238242

AN - SCOPUS:84856228797

VL - 100 A

SP - 757

EP - 767

JO - Journal of Biomedical Materials Research - Part A

JF - Journal of Biomedical Materials Research - Part A

SN - 0021-9304

IS - 3

ER -