TY - GEN
T1 - Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method
AU - Huang, Yanhui
AU - Krentz, Timothy Michael
AU - Nelson, J. Keith
AU - Schadler, Linda S.
AU - Li, Yang
AU - Zhao, He
AU - Brinson, L. Catherine
AU - Bell, Michael
AU - Benicewicz, Brian
AU - Wu, Ke
AU - Breneman, Curt M.
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/12/22
Y1 - 2014/12/22
N2 - Finite element 2-D analysis was implemented to simulate the dielectric spectra of nanodielectrics. As a test case, silica modified with a high graft density of short molecules and a low graft density of epoxy compatible chains were incorporated into epoxy. TEM images of the composites filler distribution were used to construct the model geometry with the interfacial area specifically included. The interfacial area was found to have dielectric relaxation behavior different from that of the matrix, as described by additional fitting parameters. This modeling method has the potential to improve our understanding of the impact of interface properties on the dielectric properties of composites.
AB - Finite element 2-D analysis was implemented to simulate the dielectric spectra of nanodielectrics. As a test case, silica modified with a high graft density of short molecules and a low graft density of epoxy compatible chains were incorporated into epoxy. TEM images of the composites filler distribution were used to construct the model geometry with the interfacial area specifically included. The interfacial area was found to have dielectric relaxation behavior different from that of the matrix, as described by additional fitting parameters. This modeling method has the potential to improve our understanding of the impact of interface properties on the dielectric properties of composites.
UR - http://www.scopus.com/inward/record.url?scp=84936773732&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84936773732&partnerID=8YFLogxK
U2 - 10.1109/CEIDP.2014.6995897
DO - 10.1109/CEIDP.2014.6995897
M3 - Conference contribution
AN - SCOPUS:84936773732
T3 - 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
SP - 748
EP - 751
BT - 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
Y2 - 19 October 2014 through 22 October 2014
ER -