Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method

Yanhui Huang, Timothy Michael Krentz, J. Keith Nelson, Linda S. Schadler, Yang Li, He Zhao, L. Catherine Brinson, Michael Bell, Brian Benicewicz, Ke Wu, Curt M. Breneman

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    15 Scopus citations

    Abstract

    Finite element 2-D analysis was implemented to simulate the dielectric spectra of nanodielectrics. As a test case, silica modified with a high graft density of short molecules and a low graft density of epoxy compatible chains were incorporated into epoxy. TEM images of the composites filler distribution were used to construct the model geometry with the interfacial area specifically included. The interfacial area was found to have dielectric relaxation behavior different from that of the matrix, as described by additional fitting parameters. This modeling method has the potential to improve our understanding of the impact of interface properties on the dielectric properties of composites.

    Original languageEnglish (US)
    Title of host publication2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages748-751
    Number of pages4
    ISBN (Electronic)9781479975235
    DOIs
    StatePublished - Dec 22 2014
    Event2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 - Des Moines, United States
    Duration: Oct 19 2014Oct 22 2014

    Publication series

    Name2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014

    Other

    Other2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
    Country/TerritoryUnited States
    CityDes Moines
    Period10/19/1410/22/14

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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