Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method

Yanhui Huang, Timothy Michael Krentz, J. Keith Nelson, Linda S. Schadler, Yang Li, He Zhao, L. Catherine Brinson, Michael Bell, Brian Benicewicz, Ke Wu, Curt M. Breneman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Finite element 2-D analysis was implemented to simulate the dielectric spectra of nanodielectrics. As a test case, silica modified with a high graft density of short molecules and a low graft density of epoxy compatible chains were incorporated into epoxy. TEM images of the composites filler distribution were used to construct the model geometry with the interfacial area specifically included. The interfacial area was found to have dielectric relaxation behavior different from that of the matrix, as described by additional fitting parameters. This modeling method has the potential to improve our understanding of the impact of interface properties on the dielectric properties of composites.

Original languageEnglish (US)
Title of host publication2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages748-751
Number of pages4
ISBN (Electronic)9781479975235
DOIs
StatePublished - Jan 1 2014
Event2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 - Des Moines, United States
Duration: Oct 19 2014Oct 22 2014

Publication series

Name2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014

Other

Other2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
CountryUnited States
CityDes Moines
Period10/19/1410/22/14

Fingerprint

Dielectric relaxation
Brushes
Grafts
Finite element method
Composite materials
Dielectric properties
Fillers
Silica
Transmission electron microscopy
Molecules
Geometry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Huang, Y., Krentz, T. M., Nelson, J. K., Schadler, L. S., Li, Y., Zhao, H., ... Breneman, C. M. (2014). Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method. In 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 (pp. 748-751). [6995897] (2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP.2014.6995897

Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method. / Huang, Yanhui; Krentz, Timothy Michael; Nelson, J. Keith; Schadler, Linda S.; Li, Yang; Zhao, He; Brinson, L. Catherine; Bell, Michael; Benicewicz, Brian; Wu, Ke; Breneman, Curt M.

2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 748-751 6995897 (2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Huang, Y, Krentz, TM, Nelson, JK, Schadler, LS, Li, Y, Zhao, H, Brinson, LC, Bell, M, Benicewicz, B, Wu, K & Breneman, CM 2014, Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method. in 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014., 6995897, 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014, Institute of Electrical and Electronics Engineers Inc., pp. 748-751, 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014, Des Moines, United States, 10/19/14. https://doi.org/10.1109/CEIDP.2014.6995897
Huang Y, Krentz TM, Nelson JK, Schadler LS, Li Y, Zhao H et al. Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method. In 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 748-751. 6995897. (2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014). https://doi.org/10.1109/CEIDP.2014.6995897
Huang, Yanhui ; Krentz, Timothy Michael ; Nelson, J. Keith ; Schadler, Linda S. ; Li, Yang ; Zhao, He ; Brinson, L. Catherine ; Bell, Michael ; Benicewicz, Brian ; Wu, Ke ; Breneman, Curt M. / Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method. 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 748-751 (2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014).
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