The effects of common errors on sealing ability of total-etch adhesives

Masanori Hashimoto, Franklin Chi Meng Tay, Nadia R. Svizero, Anton J.de Gee, Albert J. Feilzer, Hidehiko Sano, Masayuki Kaga, David Henry Pashley

Research output: Contribution to journalArticle

51 Citations (Scopus)

Abstract

Objectives: This study evaluated the effect of errors commonly made in using total-etch adhesives, on the resulting bond strength, fluid movement and nanoleakage of resin dentin bonds. Methods: Two total-etch adhesives were used for bonding to dentin according to the manufacturers' recommendations, with meticulous solvent evaporation (control), or with the introduction of common bonding errors-wet bonding without solvent evaporation (no evaporation), and dry bonding. Results: The 24-hour bond strength of the control was significantly higher than the other groups (p <0.05). For all groups, the higher initial permeability declined significantly after 24 h. The fluid movement across bonded dentin was similar in the control and dry bonding for both adhesives, whereas significantly higher permeability (p<0.05) was recorded for the no evaporation groups even after 24 h. Extensive silver impregnation within hybrid layers was seen by TEM in the no evaporation and dry bonding specimens after 24 h. Dry bonding caused collapse of the collagen matrix and interfered with resin infiltration. In contrast, inadequate solvent evaporation and/or residual water during dentin bonding results in dilution or incomplete polymerization of the resin, leading to severe nanoleakage formation. Significance: Increased permeability associated with incomplete solvent evaporation in total-etch adhesives may lead to poor bond strength.

Original languageEnglish (US)
Pages (from-to)560-568
Number of pages9
JournalDental Materials
Volume22
Issue number6
DOIs
StatePublished - Jun 1 2006

Fingerprint

Dentin
Adhesives
Evaporation
Permeability
Resins
Silver
Polymerization
Collagen
Fluids
Water
Bond strength (materials)
Infiltration
Impregnation
Dilution
Transmission electron microscopy

Keywords

  • Air-drying
  • Microtensile bond strength
  • Nanoleakage
  • Solvent removal
  • Water permeability

ASJC Scopus subject areas

  • Materials Science(all)
  • Dentistry(all)
  • Mechanics of Materials

Cite this

Hashimoto, M., Tay, F. C. M., Svizero, N. R., Gee, A. J. D., Feilzer, A. J., Sano, H., ... Pashley, D. H. (2006). The effects of common errors on sealing ability of total-etch adhesives. Dental Materials, 22(6), 560-568. https://doi.org/10.1016/j.dental.2005.06.004

The effects of common errors on sealing ability of total-etch adhesives. / Hashimoto, Masanori; Tay, Franklin Chi Meng; Svizero, Nadia R.; Gee, Anton J.de; Feilzer, Albert J.; Sano, Hidehiko; Kaga, Masayuki; Pashley, David Henry.

In: Dental Materials, Vol. 22, No. 6, 01.06.2006, p. 560-568.

Research output: Contribution to journalArticle

Hashimoto, M, Tay, FCM, Svizero, NR, Gee, AJD, Feilzer, AJ, Sano, H, Kaga, M & Pashley, DH 2006, 'The effects of common errors on sealing ability of total-etch adhesives', Dental Materials, vol. 22, no. 6, pp. 560-568. https://doi.org/10.1016/j.dental.2005.06.004
Hashimoto, Masanori ; Tay, Franklin Chi Meng ; Svizero, Nadia R. ; Gee, Anton J.de ; Feilzer, Albert J. ; Sano, Hidehiko ; Kaga, Masayuki ; Pashley, David Henry. / The effects of common errors on sealing ability of total-etch adhesives. In: Dental Materials. 2006 ; Vol. 22, No. 6. pp. 560-568.
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