Enhanced charge trapping in bimodal brush functionalized silica-epoxy nanocomposite dielectrics

Timothy Michael Krentz, Yanhui Huang, J. Keith Nelson, Linda S. Schadler, Michael Bell, Brian Benicewicz, Su Zhao, Henrik Hillborg

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

This manuscript details the processing, and investigates the dielectric properties, of surface ligand engineered epoxy nanocomposites. They display significant improvements in dielectric breakdown strength (DBS). Thermally stimulated depolarization current (TSDC) measurements and pulsed electroacoustic analysis (PEA) results are used to investigate space charge evolution and trapping. These techniques reveal the potential underlying phenomena behind the DBS enhancement.

Original languageEnglish (US)
Title of host publication2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages643-646
Number of pages4
ISBN (Electronic)9781479975235
DOIs
Publication statusPublished - Dec 22 2014
Event2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 - Des Moines, United States
Duration: Oct 19 2014Oct 22 2014

Publication series

Name2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014

Other

Other2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
CountryUnited States
CityDes Moines
Period10/19/1410/22/14

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Krentz, T. M., Huang, Y., Nelson, J. K., Schadler, L. S., Bell, M., Benicewicz, B., ... Hillborg, H. (2014). Enhanced charge trapping in bimodal brush functionalized silica-epoxy nanocomposite dielectrics. In 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 (pp. 643-646). [6995891] (2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP.2014.6995891