Tensile bond strengths of Comspan® to electrolytically etched metal with and without enamel bonding agent

Van Benjamine Haywood, T. F. Lundeen, D. F. Taylor

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

When cementing a resin-bonded etched metal "Maryland" bridge, the clinician applies unfilled resin bonding agent to the etched metal prior to placing the filled resin cement. This study evaluated whether or not it was necessary to place the unfilled resin bonding agent on the metal. Twenty rods were cast in Rexillium III and machined so their ends could be etched and bonded together, first with filled resin alone, then with filled resin plus unfilled resin yielded an average tensile bond strength of 39.24 MPa, while the filled resin alone had an average of 32.21 MPa. At p≤.05, this was statistically insignificant, suggesting that elimination of unfilled Comspan® resin application to Rexillium III is possible without loss of bond strength.

Original languageEnglish (US)
Pages (from-to)29-32
Number of pages4
JournalDental Materials
Volume3
Issue number1
DOIs
StatePublished - Jan 1 1987
Externally publishedYes

Fingerprint

Enamels
Tensile Strength
Dental Enamel
Resins
Metals
Resin-Bonded Fixed Partial Denture
Resin Cements
Cementing (shafts)
Concrete placing
Comspan
Rexillium III
Cements

Keywords

  • acid etching
  • dental cement
  • dental prosthesis retention
  • dental restoration

ASJC Scopus subject areas

  • Mechanics of Materials
  • Materials Science(all)
  • Dentistry(all)

Cite this

Tensile bond strengths of Comspan® to electrolytically etched metal with and without enamel bonding agent. / Haywood, Van Benjamine; Lundeen, T. F.; Taylor, D. F.

In: Dental Materials, Vol. 3, No. 1, 01.01.1987, p. 29-32.

Research output: Contribution to journalArticle

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abstract = "When cementing a resin-bonded etched metal {"}Maryland{"} bridge, the clinician applies unfilled resin bonding agent to the etched metal prior to placing the filled resin cement. This study evaluated whether or not it was necessary to place the unfilled resin bonding agent on the metal. Twenty rods were cast in Rexillium III and machined so their ends could be etched and bonded together, first with filled resin alone, then with filled resin plus unfilled resin yielded an average tensile bond strength of 39.24 MPa, while the filled resin alone had an average of 32.21 MPa. At p≤.05, this was statistically insignificant, suggesting that elimination of unfilled Comspan{\circledR} resin application to Rexillium III is possible without loss of bond strength.",
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