Tensile bond strengths of Comspan® to electrolytically etched metal with and without enamel bonding agent

V. B. Haywood, T. F. Lundeen, D. F. Taylor

Research output: Contribution to journalArticlepeer-review

14 Scopus citations


When cementing a resin-bonded etched metal "Maryland" bridge, the clinician applies unfilled resin bonding agent to the etched metal prior to placing the filled resin cement. This study evaluated whether or not it was necessary to place the unfilled resin bonding agent on the metal. Twenty rods were cast in Rexillium III and machined so their ends could be etched and bonded together, first with filled resin alone, then with filled resin plus unfilled resin yielded an average tensile bond strength of 39.24 MPa, while the filled resin alone had an average of 32.21 MPa. At p≤.05, this was statistically insignificant, suggesting that elimination of unfilled Comspan® resin application to Rexillium III is possible without loss of bond strength.

Original languageEnglish (US)
Pages (from-to)29-32
Number of pages4
JournalDental Materials
Issue number1
StatePublished - Feb 1987
Externally publishedYes


  • acid etching
  • dental cement
  • dental prosthesis retention
  • dental restoration

ASJC Scopus subject areas

  • Materials Science(all)
  • Dentistry(all)
  • Mechanics of Materials


Dive into the research topics of 'Tensile bond strengths of Comspan<sup>®</sup> to electrolytically etched metal with and without enamel bonding agent'. Together they form a unique fingerprint.

Cite this